Hermetic Sealing Method For High-speed Mcms

Abstract

Evaluation of microcrack formationand hermetic sealing characteristics was carried out on a brazed low-temperature cofired ceramic (LTCC) substrate and windowframe to establish a hermetic sealing technology which utilizes the LTCC substrate for high-speed multichip modules (MCMs). A windowframe, braze alloy and a thick film conductor were selected aD sealing materials and the brazing process and design guidelines evaluated. Consequently, the formation of microcracks was clarified, which enables their elimination. High reliable hermetic characteristics were achieved by means of hermetic sealing on the LTCC substrate ueing the improved sealing material, brazing procese and design guidelines.