Nanocarbon structures for electronic applications — A critical review

G. Duesberg
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Abstract

Silicon based devices form the foundation of today's integrated circuitry. However, as advancements in information and communication technologies demand ever decreasing device feature sizes, conventional materials are ultimately reaching processing limits. Consequently, extensive research is being carried out on novel materials for future device fabrication. In this paper research on nano-carbon structures for applications beyond CMOS devices is reviewed. Progress in the synthesis, processing and integration of ultra-thin conducting carbon films, graphene and nanotubes for applications such as interconnects, transistors, spintronics and sensing are critically reviewed.
电子应用的纳米碳结构——综述
硅基器件构成了当今集成电路的基础。然而,随着信息和通信技术的进步,设备特征尺寸不断减小,传统材料最终达到了加工极限。因此,对未来设备制造的新材料进行了广泛的研究。本文综述了纳米碳结构在CMOS器件以外的应用研究。综述了超薄导电碳膜、石墨烯和纳米管的合成、加工和集成技术的进展,这些材料可用于互连、晶体管、自旋电子学和传感等领域。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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