Kangmin Lee, Se-Joong Lee, Donghyun Kim, Kwanho Kim, Gawon Kim, Joungho Kim, H. Yoo
{"title":"Networks-on-chip and Networks-in-Package for High-Performance SoC Platforms","authors":"Kangmin Lee, Se-Joong Lee, Donghyun Kim, Kwanho Kim, Gawon Kim, Joungho Kim, H. Yoo","doi":"10.1109/ASSCC.2005.251783","DOIUrl":null,"url":null,"abstract":"A structured packet-switched networks-on-chip (NoC) is designed and implemented for high-performance heterogeneous SoC design platform. The chip integrates multiprocessors, multiple memories, and other heterogeneous intellectual properties and interconnection with 51mW and 1.6GHz on-chip networks. The NoC adopts a partial activated crossbar, low-energy coding, and low-swing signaling for the power consumption optimization. A network-in-package integrating four NoCs is fabricated in a 676-BGA-type package for larger and scalable systems and demonstrates 2D-image-processing and 3D-graphics applications","PeriodicalId":341932,"journal":{"name":"2005 IEEE Asian Solid-State Circuits Conference","volume":"57 4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE Asian Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASSCC.2005.251783","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 21
Abstract
A structured packet-switched networks-on-chip (NoC) is designed and implemented for high-performance heterogeneous SoC design platform. The chip integrates multiprocessors, multiple memories, and other heterogeneous intellectual properties and interconnection with 51mW and 1.6GHz on-chip networks. The NoC adopts a partial activated crossbar, low-energy coding, and low-swing signaling for the power consumption optimization. A network-in-package integrating four NoCs is fabricated in a 676-BGA-type package for larger and scalable systems and demonstrates 2D-image-processing and 3D-graphics applications