RF and microwave characteristics of a 20nm gate length InAlN/GaN-based HEMT having a high “Figure of Merit”

A. Bhattacharjee, T. Lenka
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Abstract

In this paper we propose a new structure of InxAl1_xN/GaN based HEMT with gate length of 20nm. The InAlN barrier layer is intentionally doped to boost the “Figure of Merit”. We obtained an Ion/Ioff ratio of 1010.1 and found that it is 105 times better than the undoped barrier conventional InAlN/AlN HEMT. This excellent “Figure of Merit” of the proposed HEMT leads to low gate leakage current and extremely low parasitic capacitances and conductance than the existing conventional InAlN/AlN HEMT. Further the RF and Microwave characteristics of this proposed HEMT is presented with the help of Stern stability factor, max transducer power gain and the RF parameters are presented by Smith chart and Polar plot.
具有高“品质系数”的20nm栅长InAlN/ gan基HEMT的射频和微波特性
本文提出了一种栅极长度为20nm的基于InxAl1_xN/GaN的HEMT新结构。有意掺杂InAlN势垒层以提高“优值”。我们获得了1010.1的离子/ off比,发现它比未掺杂势垒的传统InAlN/AlN HEMT好105倍。与现有的传统InAlN/AlN HEMT相比,该HEMT具有低栅极漏电流和极低的寄生电容和电导。利用Stern稳定因子分析了该HEMT的射频和微波特性,利用Smith图和Polar图给出了最大换能器功率增益和射频参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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