B. Passmore, Z. Cole, B. McGee, M. Wells, J. Stabach, Josh Bradshaw, R. Shaw, Daniel Martin, T. McNutt, Edward VanBrunt, B. Hull, D. Grider
{"title":"The next generation of high voltage (10 kV) silicon carbide power modules","authors":"B. Passmore, Z. Cole, B. McGee, M. Wells, J. Stabach, Josh Bradshaw, R. Shaw, Daniel Martin, T. McNutt, Edward VanBrunt, B. Hull, D. Grider","doi":"10.1109/WIPDA.2016.7799900","DOIUrl":null,"url":null,"abstract":"In this work, a novel high performance 10 kV / 240 A silicon carbide (SiC) metal-oxide field-effect transistor (MOSFET) power module design is presented. The key features for this power module include reworkability, low parasitic design, low thermal resistance design, equal current sharing of high voltage power MOSFETs, and low profile and small form factor. The design tradeoffs to achieve these characteristics will be discussed. In addition, the static and dynamic electric characteristics will be presented and compared to an off-the-shelf silicon (Si) counterpart.","PeriodicalId":431347,"journal":{"name":"2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"58","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WIPDA.2016.7799900","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 58
Abstract
In this work, a novel high performance 10 kV / 240 A silicon carbide (SiC) metal-oxide field-effect transistor (MOSFET) power module design is presented. The key features for this power module include reworkability, low parasitic design, low thermal resistance design, equal current sharing of high voltage power MOSFETs, and low profile and small form factor. The design tradeoffs to achieve these characteristics will be discussed. In addition, the static and dynamic electric characteristics will be presented and compared to an off-the-shelf silicon (Si) counterpart.