A comparative study of the program efficiency of gate all around SONOS and TANOS flash memory

Junghwan Ji, Byung-Gook Park, Jong Ho Lee, Hyungcheol Shin
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引用次数: 1

Abstract

An analytic expression was obtained to examine the dependence of dielectric layers thickness and silicon radius on Vth shift, which is an important characteristic of gate all around SONOS/TANOS memory. As the radius of silicon decreases, the Vth shift decreases because of increasing capacitance in dielectric layers under the condition of same trapped charge density. The Vth shift is almost linearly dependant on bottom oxide thickness and top oxide thickness. The maximum Vth shift of TANOS is lower than that of SONOS because of high dielectric constant of blocking layer in TANOS. On the other hand, the program speed of TANOS is faster than that of SONOS.
围绕SONOS和TANOS闪存的栅极程序效率的比较研究
得到了介质层厚度和硅半径对Vth位移的解析表达式,这是SONOS/TANOS存储器的一个重要特性。在捕获电荷密度不变的情况下,随着硅半径的减小,由于介电层中电容的增加,Vth位移减小。第v次位移几乎线性依赖于底部氧化层厚度和顶部氧化层厚度。由于TANOS中阻挡层介电常数较高,TANOS的最大v值位移小于SONOS。另一方面,TANOS的程序速度比SONOS快。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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