Electrothermal characterization of SOI FinFETs

Peng Zhang, Wenchao Chen, Jun Hu, W. Yin
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引用次数: 1

Abstract

Electrothermal characterization of the advanced SOI FinFETs is performed in this paper, which is based on some analytical equations as well as in-house developed finite difference algorithm. The temperature-dependent properties of thermal conductivities of all materials involved are considered in our simulation, with results validated by the commercial software ANSYS and other analytical solution. The self-heating effects (SHE) in such FinFET at 50nm node are further investigated, and some analytical equations are derived for fast predicting the maximum temperature in its channel. On the other hand, transient temperature response under the circuit-speed random stress is also studied, which is mimicked by the Pseudo Random Binary Sequence signal. It is found that the AC and PRBS signals introduce the similar transient temperature response, while the lower frequency signal induces the worse self-heating effect.
SOI finfet的电热特性
本文基于一些解析方程和自主开发的有限差分算法,对先进的SOI finfet进行了电热表征。我们的模拟考虑了所有材料的热导率的温度依赖特性,并通过商业软件ANSYS和其他分析解决方案验证了结果。进一步研究了该FinFET在50nm节点的自热效应,并推导了一些快速预测其通道最高温度的解析方程。另一方面,研究了电路速度随机应力下的瞬态温度响应,并用伪随机二值序列信号模拟。结果表明,交流和PRBS信号的瞬态温度响应相似,低频信号的自热效应较差。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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