Aluminum/Diamond Composites and Their Applications in Electronic Packaging

Abstract

For the outstanding properties of diamond and aluminum, diamond reinforced aluminum matrix composites have been developed. In nowadays, Al/diamond composites can be fabricated by many different techniques. Among these fabrication methods, gas pressure infiltration and squeeze casting infiltration are regarded promising and effective. The micro structure and interface reaction of Al/diamond composites are discussed in this paper. The results show that though the forming of Al4C3 on the interface of Al/diamond composite can improve the bonding condition, it also has negative effect on the thermal properties of the composites. The thermal conductivities and CTEs of Al/diamond composites are the property mainly studied. Unfortunately, the thermal degradation of diamond has precluded its use as reinforcement. Now, MER Corporation has developed commercial products of Al/diamond composites, and has used them in some electronic packages. We can believe that Al/diamond composite materials will play much more important roles in the thermal management of electronic packaging.