Reliability analysis of small delay defects in vias located in signal paths

Abstract

Vias-open defects are one of the dominant failures in modern nanometer technologies and may pose a reliability issue. In this paper, the reliability electromigration risk posed by undetected small delays due to resistive opens in vias located in signal paths is quantified. The Mean Time to Failure as function of the void size, using a cylinder model for the defective via, is estimated. Both effects, electromigration and self heating, have been considered. Reliability analysis considering redundant vias is also presented.