A parallel iterative layered-medium integral-equation solver for electromagnetic analysis of electronic packages

C. Liu, K. Aygün, H. Braunisch, V. Okhmatovski, A. Yılmaz
{"title":"A parallel iterative layered-medium integral-equation solver for electromagnetic analysis of electronic packages","authors":"C. Liu, K. Aygün, H. Braunisch, V. Okhmatovski, A. Yılmaz","doi":"10.1109/EPEPS.2017.8329759","DOIUrl":null,"url":null,"abstract":"A parallel iterative solver for multiport network parameter extraction of large-scale electronic packages is presented. The proposed solver is based on a frequency-domain integral-equation formulation that accounts for the substrate using planar layered-medium Green's functions, conductor loss/ roughness using an impedance boundary condition, and port truncations using a non-radiating lumped port model. The parallel iterative solution is accelerated by a sparse preconditioner and an FFT-based matrix-vector multiplication algorithm. A scalability study demonstrates the solver's suitability for analyzing high-fidelity and large-scale package models.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2017.8329759","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

A parallel iterative solver for multiport network parameter extraction of large-scale electronic packages is presented. The proposed solver is based on a frequency-domain integral-equation formulation that accounts for the substrate using planar layered-medium Green's functions, conductor loss/ roughness using an impedance boundary condition, and port truncations using a non-radiating lumped port model. The parallel iterative solution is accelerated by a sparse preconditioner and an FFT-based matrix-vector multiplication algorithm. A scalability study demonstrates the solver's suitability for analyzing high-fidelity and large-scale package models.
电子封装电磁分析的平行迭代分层介质积分方程求解器
提出了一种大型电子封装多端口网络参数提取的并行迭代求解器。所提出的求解器基于频域积分方程公式,该公式使用平面层状介质格林函数来考虑衬底,使用阻抗边界条件来考虑导体损耗/粗糙度,使用非辐射集总端口模型来考虑端口截断。采用稀疏预条件和基于fft的矩阵向量乘法算法加速并行迭代解。可扩展性研究表明,求解器适用于分析高保真度和大规模的封装模型。
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