Model Development for Monolithically-Integrated E/D-Mode Millimeter-Wave InAlN/AlN/GaN HEMTs

Jun Ren, B. Song, H. Xing, Shuoqi Chen, A. Ketterson, E. Beam, T. Chou, M. Pilla, H. Tserng, Xiang Gao, P. Saunier, P. Fay
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Abstract

Device models to support circuit design efforts using monolithically-integrated enhancement- and depletion-mode high-speed InAlN/AlN/GaN HEMTs are reported. Physically- motivated modifications to the conventional empirical compact models have been included to enhance model accuracy over bias and temperature. The models have been extracted from DC through 110 GHz at baseplate temperatures from 25 °C through 100 °C; good agreement is obtained between measurement results and the extracted model.
单片集成E/ d模毫米波InAlN/AlN/GaN hemt模型开发
本文报道了采用单片集成增强和耗尽模式高速InAlN/AlN/GaN hemt支持电路设计的器件模型。为了提高模型在偏差和温度上的精度,对传统经验紧凑模型进行了物理动机的修正。在底板温度为25°C至100°C的情况下,从直流到110 GHz提取模型;测量结果与提取的模型吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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