Thermal-Induced Stress at an Electronic Chip Level

Abstract

This paper presents a numerical model of an electronic chip that heats up and dilates during normal functioning conditions. The model is based on a CAD generated computational domain, comprised of the silicon processor (the intermittent heat flux source), the embedding chip volume, the electrical contacts soldered to a PCB (printed circuit board), and a secondary, constant, heat source represented by a voltage regulator. The system is actively cooled by the surrounding air at room temperature. During its service, the ensemble heats up generating thermal stress that acts differently upon the electrical and electronic components, deforming them by their mechanical properties, geometry, and PCB placement.