Investigation on failure behaviour of solder joint during thermal fatigue

Jian Lin, Y. Lei, Haiyan Zhao, Zhong-wei Wu, Li Lu
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引用次数: 4

Abstract

In SMT, the investigation on solder joint's failure is always very important. Thermal fatigue is the main failure form for solder joint in SMT. In this paper the failure process of solder joint in SMT was investigated by both electrical resistance measurement method and crack observation method together. The characteristics of electrical resistance value variation of lead-tin and lead-free solder (SAC305) joint during thermal fatigue test were obtained. And at the same time the crack propagation in solder joint was observed. According to this, the failure rules of lead-tin and lead-free solder joint were compared. And by FEM, the relationship between electrical resistance value variation and crack propagation of solder joint during thermal fatigue test was studied, through which an criterion based on electrical resistance value variation for solder joint's failure during thermal fatigue test could be obtained from experience. It was shown from experimental results that the lead-free solder (SAC305) joint had a higher resistibility from thermal fatigue than the traditional lead-tin eutectic solder joint. And the criterion based on electrical resistance value variation was built up from the experimental and simulation results.
焊点热疲劳失效行为研究
在SMT中,焊点失效的研究一直是非常重要的。热疲劳是SMT焊点的主要失效形式。本文采用电阻测量法和裂纹观察法对SMT焊点失效过程进行了研究。获得了铅锡和无铅焊料(SAC305)接头在热疲劳试验中电阻值的变化特征。同时观察了焊点裂纹的扩展过程。在此基础上,对铅锡焊点和无铅焊点的失效规律进行了比较。采用有限元法研究了热疲劳试验中焊点电阻值变化与裂纹扩展的关系,从经验上得出了基于电阻值变化的焊点热疲劳失效判据。实验结果表明,与传统铅锡共晶焊点相比,SAC305无铅焊点具有更高的抗热疲劳性能。根据实验和仿真结果,建立了基于电阻值变化的判据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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