In-situ plasma cleaning by rotating transverse magnetic field

Abstract

In the new type of method, the rotating transverse magnetic field is added to the plasma by magnetic coils set around the chamber. Ions and radicals are forcibly pulled out from the plasma up to the inner surface of the chamber by the above magnetic field. In this method, the amount and the energy of ions and radicals can be controlled by the magnetic field intensity so as to be effective in removing the residual product. The etching rate on the inner surface gradually increases in proportion to the magnetic field intensity and becomes larger than that on the electrode at 600 Gauss.