Fabrication and Characterization of Fully Depleted SOI MOSFETs on Ultrathin Circular Diaphragms Using Cost-Effective Minimal-Fab Process

Abstract

FDSOI MOSFETs and CMOS ring oscillators with different current flow directions were fabricated on ultrathin circular diaphragms using minimal-fab process, and their electrical characteristics were systematically investigated. It was found that the drain current of the <110> channel MOSFETs and the oscillation frequency of CMOS ring oscillators are changed after diaphragm formation due to residual mechanical stress. This result is very useful for the digital type pressure sensor applications.