Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film

K. Takeda, Y. Uematsu
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Abstract

This paper describes newly developed thermally conductive circuit board. The board consists of an anodized aluminum substrate, which is coated with electrodeposited acrylic-melamine polymer. Both anodized aluminum and electrodeposited polymer work as insulating layers between aluminum core and electrical circuitry. Polymer thick film (PTF) is adopted as circuitization in the board. This paper describes manufacturing process and evaluation results of the board from the viewpoint of both electrical and thermal reliability. Two of prototype models for power application are demonstrated in this paper.
采用阳极氧化铝和聚合物厚膜的导热电路板
本文介绍了新研制的导热电路板。该板由阳极氧化铝基板组成,其上涂有电沉积的丙烯酸-三聚氰胺聚合物。阳极氧化铝和电沉积聚合物都是铝芯和电路之间的绝缘层。电路板采用聚合物厚膜(PTF)电路化。本文从电可靠性和热可靠性两方面阐述了该板的制造过程和评价结果。本文给出了两种用于功率应用的原型模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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