Material engineering in Cylindrical Surrounding Double Gate (CSDG) MOSFETs for enhanced electrostatic integrity and RF performance

Jay Hind K. Verma, Mridula Gupta, S. Haldar, R. Gupta
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引用次数: 1

Abstract

This paper investigates influence of material engineering on the performance parameter of (Cylindrical Surrounding Double Gate) CSDG MOSFET for improvement in performance. CSDG MOSFETs are evaluated for various parameters such as surface potential, electric field, drain on current, off current, transconductance, cut-off frequency and total gate input capacitance. The comparison of the gate material engineering on CSDG MOSFET has been done on the normal CSDG MOSFET incorporating dual materials at gate electrode, using the ATLAS 3D device simulator. The result shows that, with incorporation of dual materials on the gate electrode, the device performance parameter improves by shifting the higher electric field and minimum surface potential more towards the source side than in the normal CSDG MOSFET.
圆柱环绕双栅(CSDG) mosfet的材料工程,以提高静电完整性和射频性能
本文研究了材料工程对(圆柱环绕双栅)CSDG MOSFET性能参数的影响,以期提高其性能。对CSDG mosfet进行各种参数评估,如表面电位、电场、漏极导通电流、关断电流、跨导、截止频率和总栅极输入电容。利用ATLAS 3D器件模拟器,对栅极双材料的CSDG MOSFET栅极材料工程进行了比较。结果表明,与普通CSDG MOSFET相比,在栅极电极上加入双材料后,器件性能参数得到改善,较高的电场和最小表面电位更多地向源侧移动。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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