Study on impact of process on Bitcell design in FinFets

M. Anees, K. Rahul, Santosh Yachareni, Sourabh Aditya Swarnkar
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引用次数: 2

Abstract

This paper discusses the impact of process scaling on bitcells in FinFets on 7nm and beyond. Every new process node is targeted to shrink the size of transistors. Shrinking in size makes the device vulnerable to process variations. The impact of the process variations creates new design challenges. Bitcells being at the forefront of every new process nodes face all-new levels of design complexity both in terms of the fabrication process and in designing. Bitcells are placed in every chip and the density of the same keeps growing. In the 7nm process, transistor density reaches approximately 96.5M Tr/mm2 with a bitcell dimension of 0.027um2. Moving towards 3nm, number of transistors could increase by 40%-50% for the same area, because of 2-fin minimum usage requirement. Having correct contingency circuits to fix failing bitcells is very important. The contingency circuits can be read assist, write assist circuits. As supply voltage is reduced, it is reaching towards the threshold voltage. Reduction in voltage to reduce the power only aggravates the problem. This requires an understanding of the impact of the process on bitcell qualifying parameters. This paper shows how the process is impacting the bitcells and its impact can be seen by measuring the bitcells qualifying parameters.
工艺对finfet中Bitcell设计的影响研究
本文讨论了制程缩放对7nm及以上finfet中位元的影响。每一个新的工艺节点的目标都是缩小晶体管的尺寸。尺寸的缩小使设备容易受到工艺变化的影响。工艺变化的影响带来了新的设计挑战。Bitcells处于每一个新工艺节点的前沿,在制造工艺和设计方面都面临着全新的设计复杂性。每个芯片中都有比特元,并且比特元的密度不断增加。在7nm工艺中,晶体管密度达到约96.5M Tr/mm2,位元尺寸为0.027um2。向3nm方向发展,同样面积的晶体管数量可以增加40%-50%,因为2鳍的最小使用要求。拥有正确的应急电路来修复失败的位单元是非常重要的。所述应急电路可以是读辅助、写辅助电路。随着电源电压的降低,它正在接近阈值电压。通过降低电压来降低功率只会使问题恶化。这需要理解该过程对位单元格限定参数的影响。本文展示了这个过程是如何影响比特单元的,它的影响可以通过测量比特单元的合格参数来观察。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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