Optical Characteristics of Polycrystalline 3C-SiC for Harsh Environments

Junho Jeong, G. Chung
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Abstract

Raman spectra of poly (polycrystalline) 3C-SiC thin films, which were deposited on the oxidized Si substrate by APCVD, have been measured. They were used to study the mechanical characteristics of poly 3C-SiC grown in various temperatures. TO and LO modes of 2.0 mum poly 3C-SiC grown at 1180degC occurred at 794.4 and 965.7 cm-1. Their FWHMs (full width half maximum) were used to investigate the stress and the disorder of 3C-SiC. The broad FWHM can explain that the crystallinity of 3C-SiC grown at 1180degC becomes polycrystalline instead of the disordered crystal. The ratio of intensity I(LO)/I(TO) ap 1.0 means that the crystal defect of 3C-SiC/SiO2/Si is small. The biaxial stress of poly 3C-SiC was obtained as 428 MPa. In the interface of 3C-SiC/SiO2, the phonon mode of C-O bonding appeared at 1122.6 cm-1. The phonon modes related to D and G bands of C-C bonding were measured at 1355.8 and 1596.8 cm-1 respectively.
恶劣环境下多晶3C-SiC光学特性研究
用APCVD法在氧化硅衬底上沉积了多晶3C-SiC薄膜,测量了薄膜的拉曼光谱。用它们研究了在不同温度下生长的聚3C-SiC的力学特性。在1180c下生长的2.0 mum poly 3C-SiC的TO和LO模式分别出现在794.4和965.7 cm-1。用全宽半最大值FWHMs(全宽半最大值)研究了3C-SiC的应力和无序性。宽FWHM可以解释在1180c下生长的3C-SiC结晶度由无序晶体变为多晶。强度I(LO)/I(TO)比值为1.0,表明3C-SiC/SiO2/Si的晶体缺陷较小。得到了poly - 3C-SiC的双轴应力为428 MPa。在3C-SiC/SiO2界面中,在1122.6 cm-1处出现了C-O键合的声子模式。在1355.8 cm-1和1596.8 cm-1处测得C-C键D带和G带声子模。
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