Transient analysis of PCB lines with the inclusion of parameters uncertainties

Abstract

This paper presents an effective solution for the transient analysis of long bus-like interconnects with the inclusion of geometrical and material uncertainties of the structure. The proposed approach is based on the expansion of the well-known frequency-domain telegraph equations in terms of orthogonal polynomials and on the back conversion to time domain via Fourier superposition. The method is validated by means of a systematic comparison with the results of Monte Carlo simulations, for an application example involving a PCB coupled-microstrip interconnect with uncertainties in the relative dielectric permittivity and trace separation.