Wafer chip scale packages with efficient power dissipation have small foot-print for portable applications

Abstract

As personal and portable electronics are becoming more common in our society, we are also expecting these gadgets to be more functional, less expensive, smaller in size, thinner, and lower in weight. All of these conflicting requirements pose additional challenges for the product designers with thermal dissipation issues, and management of heat in the individual components as well as in the overall system. This paper presents state-of-the-art technology in miniature semiconductor packages, wafer chip scale packages (WCSP), and how they are designed to meet several of these contradicting needs.