Reliability assurance of application-specific microelectronic circuits

B. Sheu, Wen-Jay Hsu, V. Tyree
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Abstract

An integrated-circuit reliability simulator has been developed. Model parameters for the reliability simulation are obtained through accelerated tests on specially designed test structures. The design of several test chips and associated experimental results are presented. Reliability simulations are described at the detailed circuit-design level using the SPICE circuit simulator or its derivatives as the key module. A computer-automated characterization system is necessary to extract parameter values for the new degradation models.<>
专用微电子电路的可靠性保证
研制了集成电路可靠性模拟器。通过对特殊设计的试验结构进行加速试验,获得了可靠性仿真的模型参数。给出了几种测试芯片的设计和相关的实验结果。使用SPICE电路模拟器或其衍生产品作为关键模块,在详细的电路设计级别描述可靠性仿真。为提取新的退化模型的参数值,计算机自动表征系统是必要的
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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