Warpage-based optimization of the curing profile for electronic packaging polymers

Abstract

Process-induced warpage may cause serious problems for the electronic packages. In this paper, a practical methodology is developed to predict the warpage caused by the curing process of the thermosetting polymer and the subsequent cooling down phase, and an optimization method is proposed to minimum the warpage. A cure-dependent viscoelastic constitutive model is applied to describe the behavior evolution during the curing process. The cure-dependent parameters were characterized using a combinational approach of DMA and DSC measurements. Cure shrinkage was characterized with density measurement and is applied to epoxy as an initial strain for each time increment. With the simulation-based optimization procedure, an optimal curing profile could be obtained to minimise the process-induced warpage.