Hierarchical DFT with Combinational Scan Compression, Partition Chain and RPCT

P. Srinivasan, R. Farrell
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引用次数: 6

Abstract

Modular and hierarchical based test architecture are the two of the most common testing techniques used in complex SoC designs. However, modular test architectures uses an expensive (in terms of silicon area) test wrapper around each block. On the other hand hierarchical test architecture requires additional effort at block level to isolate each block from surrounding blocks and a TAM to perform scan compression. In this paper, we analyze the limitations of the modular test architecture. Based on the analysis, we propose a test plan for hierarchical test architecture by integrating partition chain, combinational scan compression and (RPCT) reduced pin count test. Experimental results show that approximately 50% of DFT area can be reduced using the partition chain as compared to standard test wrapper. It also demonstrates the feasibility of the proposed test plan using a commercial ATPG tool.
结合扫描压缩、分区链和RPCT的层次DFT
模块化和分层测试架构是复杂SoC设计中最常用的两种测试技术。然而,模块化测试体系结构在每个块周围使用昂贵的(就硅面积而言)测试包装器。另一方面,分层测试体系结构需要在块级别上进行额外的工作,以将每个块与周围的块隔离开来,并需要TAM来执行扫描压缩。本文分析了模块化测试体系结构的局限性。在此基础上,提出了一种结合分区链、组合扫描压缩和(RPCT)减少引脚数测试的分层测试体系结构的测试方案。实验结果表明,与标准测试包装器相比,使用分区链可以减少约50%的DFT面积。它还证明了使用商用ATPG工具所提出的测试计划的可行性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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