High performance packaged electronics for the IBM ES9000 mainframe

Abstract

An 1100 circuit bipolar gate array and a multi-chip high density glass-ceramic module are described. The chip features multiple logic circuit families built using a modular cell approach. Key features include use of a capacitor for faster ECL delays and the introduction of a 200 mV signal swing differential cascode current switch. The module offers a glass ceramic substrate featuring a dielectric constant of 5.2 and a total of 63 layers of metallization. The cooling capability has been increased to 30 W per chip.<>