Thermoplastic Die Attach for Hermetic Packaging

Abstract

When selecting die attach material for hermetic packaging the user has been limited to two options; gold-silicon eutectic ribbon and silver/glass paste. Recently, new developments in high temperature polymer technology have opened up new options for hermetic die attach. New high temperature thermoplastic adhesives have been developed that can be bonded in seconds and offer the ability to rework the die attach by re-melting the adhesive. The process window and functional performance of two thermoplastic die attach materials were evaluated for their suitability for use in solder sealed cofired pin grid array ceramic and glass sealed ceramic quad flat packages. The process parameters of Time, Temperature, Pressure, and Scrub were investigated to determine the optimal manufacturing conditions.