An overview of light decay failure modes in lead-frame LED packages

Youxing Yuan, He Wang, J. G. Liu
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引用次数: 3

Abstract

One of the most commonly used LED packages on market is the mid-power LED in a lead-frame package, because of its low cost and high lumen efficiency. However, as the lead-frame package consists silver plated copper and white plastic housing, both for increased light reflection; it can gradually become yellowing or darkening when reacting with certain organic gases or chemical compounds when accelerated by high temperature and light radiation. As a result, light decay or lumen reduction can occur in LED lightings. This paper presents an overview on light decay failure modes of commonly used lead-frame LED package. Four types of failure root cause will be discussed: 1) sulfur induced silver darkening; 2) Halogen (Br, Cl) induced silver and silicone encapsulation yellowing; 3) incompatible volatile organic compounds (VOCs) resulted darkening on or around of LED chips; 4) plastic housing material yellowing.
引线框架LED封装的光衰失效模式概述
市场上最常用的LED封装之一是中功率LED引线框架封装,因为它成本低,流明效率高。然而,由于铅框封装由镀银铜和白色塑料外壳组成,两者都增加了光反射;与某些有机气体或化合物反应时,经高温和光辐射加速,可逐渐变黄或变暗。因此,在LED照明中会发生光衰或流明减少。本文综述了常用引线框架LED封装的光衰失效模式。讨论了四种失效的根本原因:1)硫致银变黑;2)卤素(Br、Cl)诱导银、硅包封变黄;3)不相容的挥发性有机化合物(VOCs)导致LED芯片表面或周围变暗;4)塑料外壳材料变黄。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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