An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

S. Haque, K. Xing, R. Lin, C. Suchicital, G. Lu, Dennis P. Nelson, D. Borojevic, F. Lee
{"title":"An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures","authors":"S. Haque, K. Xing, R. Lin, C. Suchicital, G. Lu, Dennis P. Nelson, D. Borojevic, F. Lee","doi":"10.1109/ECTC.1998.678819","DOIUrl":null,"url":null,"abstract":"Power Electronics Building Blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At Virginia Power Electronics Center (VPEC), we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"83","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1998.678819","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 83

Abstract

Power Electronics Building Blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At Virginia Power Electronics Center (VPEC), we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating.
利用金属柱相互连接的平行板结构包装电力电子积木的创新技术
电力电子构建模块(PEBBs)被设想为集成功率模块,由功率半导体器件、功率集成电路、传感器和保护电路组成,适用于广泛的电力电子应用,例如用于电机驱动的逆变器和用于电力处理设备的转换器。在弗吉尼亚电力电子中心(VPEC),我们开发了一种基本构建模块的拓扑结构-一种具有内置栅极驱动器和保护电路、光纤接收/发送接口和软开关功能的图腾极配置的双开关双二极管半桥转换器。基于该拓扑结构,使用为该项目开发的创新封装技术——金属柱互连平行板结构(MPIPPS),制作了一系列额定电压为600 V、3.3 kW的原型模块。这种新的封装技术使用大块铜的直接连接,而不是细铝线的线粘接,用于互连电源设备。封装器件的电气性能数据表明,集成三个原型模块可以构建一个风冷式15 kW逆变器,工作在400 V直流母线上,开关频率为20 kHz,这几乎是相同额定值的商业封装器件无法实现的两倍。
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