C. English, G. Shine, V. Dorgan, K. Saraswat, E. Pop
{"title":"Improving contact resistance in MoS2 field effect transistors","authors":"C. English, G. Shine, V. Dorgan, K. Saraswat, E. Pop","doi":"10.1109/DRC.2014.6872363","DOIUrl":null,"url":null,"abstract":"MoS<sub>2</sub> is a material of interest for two-dimensional (2D) field effect transistors (FETs) [1-3], however contact resistance (R<sub>c</sub>) remains a key limiting factor. Here we present a systematic study of contact resistance to MoS<sub>2</sub> using various metals with different deposition conditions, compared to detailed simulations. We find that decreasing the metal deposition pressure improves the metal-MoS2 interface and brings R<sub>c</sub> for Au contacts to <;1 kΩ-μm, which is lower than previous reports with Ni, Sc, or Au [1,4]. Comparison to simulations suggest that while the contact resistivity is reasonably good (ρc ≈ 5·10<sup>-7</sup> Ω·cm<sup>2</sup>), the lateral access resistance limits Rc in MoS<sub>2</sub> FETs. This study is crucial for scalability of MoS<sub>2</sub> devices, also suggesting methods to further improve Rc.","PeriodicalId":293780,"journal":{"name":"72nd Device Research Conference","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"72nd Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DRC.2014.6872363","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
Abstract
MoS2 is a material of interest for two-dimensional (2D) field effect transistors (FETs) [1-3], however contact resistance (Rc) remains a key limiting factor. Here we present a systematic study of contact resistance to MoS2 using various metals with different deposition conditions, compared to detailed simulations. We find that decreasing the metal deposition pressure improves the metal-MoS2 interface and brings Rc for Au contacts to <;1 kΩ-μm, which is lower than previous reports with Ni, Sc, or Au [1,4]. Comparison to simulations suggest that while the contact resistivity is reasonably good (ρc ≈ 5·10-7 Ω·cm2), the lateral access resistance limits Rc in MoS2 FETs. This study is crucial for scalability of MoS2 devices, also suggesting methods to further improve Rc.