A Compact Fully Integrated High-Efficiency 5GHz Stacked Class-E PA in 65nm CMOS Based on Transformer-Based Charging Acceleration

Jing Chen, R. Bhat, H. Krishnaswamy
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引用次数: 5

Abstract

Device stacking enables CMOS power amplifiers (PAs) to increase the maximum achievable output voltage swing by sharing the voltage stress across multiple stacked devices, leading to higher output power and efficiency. A key requirement in stacked class-E power amplifiers is the creation of class-Elike voltage swings at the intermediary nodes. In this paper, we propose a transformer-based charging acceleration technique for stacked class-E PAs. Specifically, in a 2- stacked class-E PA, a shunt inductor is connected at the intermediary node and is magnetically coupled to the choke inductor. When compared with the conventional approach of using an uncoupled shunt inductor, the transformer-based charging acceleration approach significantly reduces the sizes of both inductors and also eliminates the extra area of the shunt inductor through vertical stacking of the windings. Because of the reduced inductor sizes, the associated loss is also reduced leading to an improvement in efficiency of approximately 7% for the 5GHz prototype described here. The differential 5GHz class-E prototype is fabricated in a standard 65nm low-power (LP) CMOS process (IBM 10LPe), and achieves a drain efficiency of 42% and an output power of 19.7dBm while consuming only 0.31mm2 of chip area.
基于变压器充电加速的65nm CMOS紧凑全集成高效5GHz堆叠级e级PA
器件堆叠使CMOS功率放大器(PAs)能够通过在多个堆叠器件之间共享电压应力来增加可实现的最大输出电压摆幅,从而提高输出功率和效率。堆叠型e类功率放大器的一个关键要求是在中间节点产生类电压波动。在本文中,我们提出了一种基于变压器的充电加速技术,用于堆叠e类PAs。具体来说,在两个堆叠的e类PA中,在中间节点连接一个分流电感器,并与扼流圈电感器磁耦合。与使用非耦合并联电感的传统方法相比,基于变压器的充电加速方法显着减小了两个电感的尺寸,并且通过垂直堆叠绕组消除了并联电感的额外面积。由于减小了电感尺寸,相关损耗也减少了,从而使此处描述的5GHz原型的效率提高了约7%。差分5GHz e类原型机采用标准65nm低功耗(LP) CMOS工艺(IBM 10LPe)制造,漏极效率为42%,输出功率为19.7dBm,芯片面积仅为0.31mm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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