Alignment Techniques For High Precision Pick And Place In Electronic Packaging

Abstract

High density, high performance circuitry requires precision placement of components to optimize signal ropagation. As the tolerance for pick-and-place operations geing tightened, alignment mechanism must evolves to com ete. A detailed study on alignment not only includes the objectivity and operational process. In this article, we investigate two ap roaches for alignment, and detail the comparison. The grst method employs a calibration process to precisely locate machine components, such as measuring apparatus and end-effectors, relative to the moving mechanism. Mechanical stability is assumed. The second approach performs alignment while the object is very close to the target. The alignment method does not require precise system calibration of the system. Applications in MCM, such as hybrid, TAB, Flipchip, Flip-Chip-on-Glass, are analyzed. To effectively demonstrate the alignment approaches, mec I: anical and optical limitations, but also considers its