Effects of Thermal Boundary Resistance on the Thermal Performance of GaN HEMT on Diamond

A. Helou, M. Tadjer, K. Hobart, P. Raad
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引用次数: 1

Abstract

GaN high power devices experience substantial self-heating that drives operation temperatures beyond a safe and reliable limit, which has led to the consideration of high conductivity substrates. This study presents a coupled experimental and numerical investigation of the effectiveness of CVD-Diamond as a substrate for GaN HEMTs. The study uses a novel that optimizes a thermal model using an experimentally observed thermal response. The model is then used to assess the effect of the GaN-Di interface on the thermal response of GaN-Di HEMTs, which would serve as a guideline for future developments in GaN and Di growth.
热边界阻对金刚石表面GaN HEMT热性能的影响
氮化镓大功率器件经历了大量的自热,使得工作温度超过了安全可靠的极限,这导致了对高导电性衬底的考虑。本研究对cvd -金刚石作为GaN hemt衬底的有效性进行了实验和数值研究。该研究使用了一种新颖的方法,利用实验观察到的热响应来优化热模型。然后,该模型用于评估GaN-Di界面对GaN-Di hemt热响应的影响,这将为GaN和Di生长的未来发展提供指导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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