X-band transmit/receive module overview

B. Kopp
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引用次数: 20

Abstract

This paper will discuss pertinent issues and trends in X-band transmit/receive (T/R) modules. The performance of gallium arsenide (GaAs) T/R module components and wide bandgap semiconductors will be presented along with future challenges. T/R module cost will also be addressed with an emphasis on semiconductor cost factors and issues. Finally, a brief discussion of packaging and assembly issues will be provided.
x波段发射/接收模块概述
本文将讨论x波段收发(T/R)模块的相关问题和趋势。砷化镓(GaAs) T/R模块组件和宽带隙半导体的性能将与未来的挑战一起提出。T/R模组成本也将着重于半导体成本因素和问题。最后,将简要讨论包装和装配问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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