The influence of process variations on the Halo MOSFETs and its implications on the analog circuit performance

K. Narasimhulu, S. Narendra, V. Rao
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引用次数: 4

Abstract

Lateral Asymmetric Channel (LAC) and Double Halo (DH) MOSFETs have been reported to exhibit excellent properties for mixed signal CMOS applications. In this work, the effect of process variations such as gate oxide thickness, implantation parameters, and channel length are systematically investigated on the device and analog circuit performance for all these technologies. The performance parameters of LAC and DH differential amplifiers and current mirror circuits are evaluated, using mixed-mode simulations, as a function of process induced mismatch. Our simulation results on differential amplifiers and current mirrors show that, an identical V, mismatch in CON, DH, and LAC devices results in a lower variation in the circuit parameters for LAC technologies. It is found that, for a specified circuit parameter variation, almost a 25% higher V, mismatch is tolerable with LAC technologies as compared to the CON technologies.
工艺变化对晕轮mosfet的影响及其对模拟电路性能的影响
据报道,横向非对称通道(LAC)和双晕(DH) mosfet在混合信号CMOS应用中表现出优异的性能。在这项工作中,系统地研究了工艺变化(如栅氧化层厚度、注入参数和通道长度)对所有这些技术的器件和模拟电路性能的影响。采用混合模式仿真,对LAC和DH差分放大器和电流镜像电路的性能参数进行了评估,作为过程诱导失配的函数。我们对差分放大器和电流镜的仿真结果表明,在CON、DH和LAC器件中,相同的V、不匹配导致LAC技术的电路参数变化较小。研究发现,与CON技术相比,对于指定的电路参数变化,几乎高25%的V, LAC技术可以容忍不匹配。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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