Large in-plane displacement microactuators based on electro-thermal bimorphs with folded multiple segments

2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII) Pub Date : 2013-06-16 DOI:10.1109/TRANSDUCERS.2013.6627086

S. Pal, S. Samuelson, X. Zhang, Huikai Xie

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引用次数: 4

Abstract

A mechanism for achieving large in-plane displacement is proposed, fabricated and tested. A key distinguishing feature of this mechanism is that it employs bimorph actuator beams, which have traditionally been used for achieving out-of-plane displacements only. A combination of rigid beams and bimorphs amplifies in-plane displacements and minimizes out-of-plane displacements produced by the bimorphs. A test structure with thermal bimorphs and an embedded resistive heater is fabricated; a maximum displacement of 135 μm is measured at just 3.8 V dc. The mechanism may also be implemented using bimorphs and multimorphs based on piezoelectric effect, electroactive polymers, shape memory alloys, magnetostriction, and electrostriction. Possible applications include movable MEMS stages, integrated Michelson interferometers, temperature sensors, and movable microneedles.

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基于多段折叠电热双晶片的面内大位移微致动器

提出了一种实现大平面内位移的机构，并进行了制造和试验。该机构的一个关键特征是它采用双晶片作动器梁，传统上仅用于实现面外位移。刚性梁和双晶片的组合放大了平面内位移，最小化了双晶片产生的平面外位移。制造了一种具有热双晶和嵌入式电阻加热器的测试结构;在3.8 V dc下测量到的最大位移为135 μm。该机制也可以使用基于压电效应、电活性聚合物、形状记忆合金、磁致伸缩和电致伸缩的双晶和多晶来实现。可能的应用包括可移动MEMS级，集成迈克尔逊干涉仪，温度传感器和可移动微针。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)

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