Diagnostics of thermal stress in MEMS pressure transducer based on Tenso-e.m.f. effect

Abstract

The article examines physical principles, conceptual design and fabrication of integrated pressure transducer manufactured by means of microelectronic technology — MEMS and its optimization questions. Spatial distribution of the intrinsic stress caused by the transducer manufacturing and its current heating by supply current was studied by the method of modulation polarimetry.