W. Ki, Minjae Choi, Yong-Koun Lee, Kiseop Yoon, Hanchan Hwang, Jisoo Park, Taewook Kang, Jaeyong Park, Younghoon Kim
{"title":"Graphical approach of equipment health monitoring using network analysis","authors":"W. Ki, Minjae Choi, Yong-Koun Lee, Kiseop Yoon, Hanchan Hwang, Jisoo Park, Taewook Kang, Jaeyong Park, Younghoon Kim","doi":"10.1109/EDTM55494.2023.10102976","DOIUrl":null,"url":null,"abstract":"As the complexity of semiconductor devices increases, new approaches are required for monitoring equipment health. In this paper, we adopt the weighted gene co-expression network analysis (WGCNA) for sensor data following in three stages: 1) construction of networks, 2) identification of modules, and 3) detection of abnormal sensors by the graphical approach. Therefore, manufacturing process conditions are able to modify, the similarity between sensors was increased, and in return 0.3% yield rate gain is achieved.","PeriodicalId":418413,"journal":{"name":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTM55494.2023.10102976","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
As the complexity of semiconductor devices increases, new approaches are required for monitoring equipment health. In this paper, we adopt the weighted gene co-expression network analysis (WGCNA) for sensor data following in three stages: 1) construction of networks, 2) identification of modules, and 3) detection of abnormal sensors by the graphical approach. Therefore, manufacturing process conditions are able to modify, the similarity between sensors was increased, and in return 0.3% yield rate gain is achieved.