Structural Robustness Study of a Computer Motherboard

Yu Yating, Du Ping’an, Gan Ezhong
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引用次数: 5

Abstract

In this paper, two modal analysis methods are addressed to research the structural robustness of a computer motherboard. One is experimental modal analysis, and the other is computational modal analysis. Experimental modal analysis is carried out by single input multiple output method and the modal parameters of computer motherboard are extracted by multiple reference point modal parameter extraction method in frequency domain. Computational modal analysis is fulfilled by finite element method (FEM). In order to reduce the FE model scale, the locally stiffened regions, such as CPU, PCI sockets, ISA sockets, chipset, memory sockets, were simplified as blocks. The material properties parameters of these regions are measured by electric-test experiments on samples removed from the motherboard. According to finite element (FE) modeling theory, the FE model of the motherboard is constructed, as well as computational modal analysis is performed. By comparison, the result from experimental modal analysis agrees well with those from computational modal analysis. Finally, the underlying resonance regions under different natural frequency are discussed, which will provide some references to optimize and design the structure of the motherboard, as well as to redistribute the components assembled on the motherboard reasonably.
计算机主板结构稳健性研究
本文采用两种模态分析方法来研究计算机主板的结构鲁棒性。一种是试验模态分析,另一种是计算模态分析。采用单输入多输出法进行实验模态分析,采用频域多参考点模态参数提取法提取计算机主板模态参数。计算模态分析采用有限元法完成。为了减小有限元模型的规模,将CPU、PCI插槽、ISA插槽、芯片组、内存插槽等局部加强区域简化为块。这些区域的材料性能参数是通过从主板上取下样品的电测试实验来测量的。根据有限元建模理论,建立了主板的有限元模型,并进行了计算模态分析。通过比较,试验模态分析结果与计算模态分析结果吻合较好。最后,讨论了不同固有频率下的底层共振区域,为主板结构的优化设计以及主板上组件的合理配置提供参考。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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