Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits

Abstract

The results of simulation, and material performance testing of anisotropic conductive polymers for flip chip interconnects necessary for power MMICs are reported. The flip chip interconnects are designed to connect source metallization to a common ground plane, and also to provide for heat sinking paths to a ceramic substrate. Finite Element Analysis results are also reported simulating the thermal mechanical stresses present during high frequency operation at a frequency of 1–10 GHz.