Yield Improvement Using Fail Signature Detection Algorithm (FSDA)

The 17th Annual SEMI/IEEE ASMC 2006 Conference Pub Date : 2006-05-22 DOI:10.1109/ASMC.2006.1638757

Anand Inani, R. Burch, J. Kim, B. Stine

引用次数: 3

Abstract

An effective yield ramp methodology is demonstrated using fail signature detection algorithm (FSDA). Wafers with similar yield spatial patterns are grouped together to find stronger correlations to equipment data. Many signals that would have been missed otherwise were found leading to significant yield improvement

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基于故障签名检测算法(FSDA)的成品率提高

利用故障特征检测算法(FSDA)证明了一种有效的产量斜坡方法。具有相似产量空间模式的晶圆被分组在一起，以找到与设备数据更强的相关性。许多原本会被忽略的信号被发现，从而显著提高了产量

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

The 17th Annual SEMI/IEEE ASMC 2006 Conference

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