Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967656

K. Coperich, Jason Money, Andreas C. Cangellark, A. Ruehli

引用次数: 66

Abstract

The development of a physically consistent multi-conductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is proposed for the construction of SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion.

查看原文本刊更多论文

损耗介质中高速互连的物理一致传输线模型

提出了一种用于损耗色散介质中高速互连的物理一致的多导体传输线模型。在此基础上，提出了一种考虑介电损耗和色散的spice兼容等效电路的构造方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

自引率

0.00%

发文量