The physical phenomena responsible for excess noise in short-channel MOS devices

R. Navid, R. Dutton
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引用次数: 26

Abstract

The physical phenomena responsible for the excess noise in short-channel MOS devices are explained based on the non-equilibrium noise theory. Comparing the MOS excess noise with the well known excess noise in a mesoscopic conductor, it is suggested that the physical origins of both are the same. Using this theory, it is proposed that the noise sources used in the impedance field method (IFM) should contain not only the usual thermal noise component, but also a partially suppressed shot noise term which accounts for the limited number of inelastic scattering events in the channel. The theoretical predictions of a simplified model based on this theory are presented and compared with the measurement results. It is shown both theoretically and experimentally that the non-equilibrium noise component is smaller when a larger gate to source voltage is applied. The accurate calculation of the suppression factor, which is in general a function of device terminal voltages, remains a challenge.
基于非平衡噪声理论解释了短通道MOS器件中产生过量噪声的物理现象。将MOS的过量噪声与介观导体中的过量噪声进行比较,认为两者的物理根源是相同的。利用这一理论,提出了阻抗场法(IFM)中使用的噪声源不仅应包含通常的热噪声分量,还应包含部分抑制的弹丸噪声项,这一项可以解释通道中有限数量的非弹性散射事件。给出了基于该理论的简化模型的理论预测,并与实测结果进行了比较。理论和实验均表明,栅极源电压越大,非平衡噪声分量越小。抑制因子通常是器件端子电压的函数,其精确计算仍然是一个挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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