A Microstrip Fixture Design for Power GaAs Fets

Abstract

Small signal,(low power) devices can very adequately be In the new microstrip design the chip is die attached directly to a gold plated copper or brass carrier which is in intimate thermal contact with a finned aluminum heat sink. This results in an "unblown" thermal resistance of 3.S°C/Watt and a "blown" Rth of 1,6OC/Watt.