Effects of Bosch scallops on metal layer stress of an open Through Silicon Via technology

Abstract

Through Silicon Via (TSV) is a lead topic in interconnects and 3D integration research, mainly due to numerous anticipated advantages. However, several challenges must still be overcome if large scale production is to be achieved. In this work, we have studied effects of Bosch scallops concerning mechanical reliability for a specific TSV technology. The presence of scallops on the TSV wall modifies the stress distribution along the via. By means of Finite Element Method (FEM) simulations, we could assess this change and understand the process. The achieved results support experiments and give a better insight into the influence of scallops on the stress in an open TSV.