Highly Integrated 4 Tbps Silicon Photonic IC for Compute Fabric Connectivity

S. Fathololoumi, C. Malouin, D. Hui, K. Al-Hemyari, K. Nguyen, P. Seddighian, Yen-Jung Chen, Ye Wang, Aidong Yan, R. Defrees, T. Liljeberg, L. Liao
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引用次数: 4

Abstract

In this work we present the design and performance of a high bandwidth, low power, low latency, and high-density Silicon Photonic integrated circuit (SiPIC) for compute interconnects. The SiPIC has more than 4 Tbps bandwidth over eight standard single mode fiber pairs. Each fiber pair carries eight DWDM transmit and receive channels operating at 32 Gbps NRZ. We integrate all photonic components and functions including lasers, semiconductor optical amplifiers (SOAs), modulators, photodetectors, spot size convertors and V-grooves onto a single silicon die. Device design and performance details are discussed.
用于计算结构连接的高集成4tbps硅光子IC
在这项工作中,我们提出了一种用于计算互连的高带宽,低功耗,低延迟和高密度硅光子集成电路(SiPIC)的设计和性能。SiPIC通过8对标准单模光纤具有超过4tbps的带宽。每个光纤对携带8个DWDM发送和接收信道,工作在32gbps NRZ。我们将所有光子元件和功能,包括激光器,半导体光放大器(soa),调制器,光电探测器,光斑尺寸转换器和v型凹槽集成到单个硅芯片上。讨论了器件的设计和性能细节。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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