Xiaotong Ma, Meng Zhang, Zhendong Jiang, Sunbin Deng, Yan Yan, Guijun Li, Rongsheng Chen, M. Wong, H. Kwok
{"title":"Output Breakdown Characteristics and the Related Degradation Behaviors in Metal Oxide Thin Film Transistors","authors":"Xiaotong Ma, Meng Zhang, Zhendong Jiang, Sunbin Deng, Yan Yan, Guijun Li, Rongsheng Chen, M. Wong, H. Kwok","doi":"10.1109/IPFA47161.2019.8984893","DOIUrl":null,"url":null,"abstract":"Output breakdown (OBD) characteristics of metal oxide thin film transistors (TFTs) is studied. Three kinds of OBD behaviors are observed, corresponding to off state, subthreshold region and on state. The device degradation behaviors under OBD voltage stress is investigated. OBD stress can induce severe device degradation in very short stress time. The degradation mechanism is tentatively discussed, incorporated with TCAD simulation.","PeriodicalId":169775,"journal":{"name":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA47161.2019.8984893","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Output breakdown (OBD) characteristics of metal oxide thin film transistors (TFTs) is studied. Three kinds of OBD behaviors are observed, corresponding to off state, subthreshold region and on state. The device degradation behaviors under OBD voltage stress is investigated. OBD stress can induce severe device degradation in very short stress time. The degradation mechanism is tentatively discussed, incorporated with TCAD simulation.