Single metal/single dielectric gate stack realizing triple effective workfunction for embedded memory application

K. Manabe, K. Masuzaki, T. Ogura, T. Nakagawa, M. Saitoh, H. Sunamura, T. Tatsumi, H. Watanabe
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引用次数: 2

Abstract

We demonstrate midgap and band-edge effective workfunctions (EWFs) control with simple metal gate process scheme (single metal gate/single gate dielectric), using impurity-segregated NiSi2/SiON structure for embedded memory application. The application of midgap and band-edge EWF enables us to lower power consumption in SRAM and logic devices by 30% and 15% compared to poly-Si devices, respectively, due to reduced channel impurity concentration, suppressed gate depletion and high carrier mobility. These results show that NiSi2/SiON stack is one of the most promising candidates for future system on chip (SoC) devices with embedded memory.
单金属/单介质栅极堆叠,实现嵌入式存储器应用的三重有效工作功能
我们演示了用简单的金属栅极工艺方案(单金属栅极/单栅极电介质)控制中隙和带边有效工作函数(ewf),使用杂质隔离的NiSi2/SiON结构用于嵌入式存储器应用。与多晶硅器件相比,中隙和带边EWF的应用使我们能够将SRAM和逻辑器件的功耗分别降低30%和15%,这是由于通道杂质浓度降低、栅极耗尽抑制和载流子迁移率高。这些结果表明,NiSi2/SiON堆栈是未来具有嵌入式存储器的片上系统(SoC)器件最有前途的候选者之一。
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