Novel and Simple Cross-sectional FIB Circuit Edit Techniques for Circuit Isolation

P. K. Tan, Y. L. Pan, S. L. Ting, A. Quah, Y. Tam, A. Teo, N. Xu, H. Thoungh, K. Kang, T. T. Yu, C. Q. Chen
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Abstract

Focused Ion Beam Circuit Edit (FIB-CE) is one of the most commonly used silicon (Si) debug tools that are often used in the semiconductor industry, especially for the new design prototype chip. With the expanding growth of semiconductor applications in different areas, such as next-generation smartphones, automotive, medical equipment, artificial intelligence, RF application, and high power devices, the new prototype chip demand has also increased. Hence, FIB-CE plays an important role in Si debugging for new designs or prototype chips. Among FIB-CE jobs in failure analysis (FA), circuit isolation is one of the common requests. This paper introduces a novel and simple cross-sectional FIB circuit edit (XFIB-CE) techniques for circuit isolation. This technique utilized a normal cross-sectional FIB as a method to cut and isolate the unwanted circuitry. Hence, it is an easier, simpler and more efficient alternative technique for FIB-CE circuit isolation as compared with the top-down FIB-CE milling technique.
用于电路隔离的新型简单截面FIB电路编辑技术
聚焦离子束电路编辑(FIB-CE)是半导体行业中最常用的硅(Si)调试工具之一,尤其适用于新设计原型芯片。随着半导体在下一代智能手机、汽车、医疗设备、人工智能、射频应用、大功率器件等不同领域的应用不断扩大,对新型原型芯片的需求也在增加。因此,FIB-CE在新设计或原型芯片的Si调试中起着重要作用。在故障分析(FA)中的FIB-CE作业中,电路隔离是常见的要求之一。本文介绍了一种新颖、简单的横截面FIB电路编辑技术(XFIB-CE)。该技术利用正常横截面FIB作为切断和隔离不需要的电路的方法。因此,与自上而下的FIB-CE铣削技术相比,它是一种更容易、更简单、更有效的FIB-CE电路隔离替代技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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