High Temperature Tensile Strength Evaluation with Non-contact Measuring Method for Small Diameter Solders Specimen

Abstract

High Temperature Tensile Strength Evaluation with Non-contact Measuring Method for Small Diameter Solders Specimen Noritake HIYOSHI This study discusses tensile strength evaluation with small diameter specimen for electronic materials at high temperatures. A small size specimen which has 5mm in diameter and a new type strain measuring method which uses a non-contact band laser to obtain accurate stress-strain relationship curve of solders at high temperatures are discussed in this study. Materials tested in this study were Sn-3.5Ag and Sn-3.0Ag-0.5Cu lead-free solders. Static tensile tests were conducted at 313K, 353K and 393K with rapid strain rate to except creep damage influence on stress-strain relationship at high temperatures. Tensile strength and proof stress of the small size specimen were almost same as that of present standard size specimen. These results indicated that newly developed tensile specimen and strain measuring method are useful for investigating the high temperature tensile mechanical properties of solders.