Summary of the 7th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells

G. Beaucarne, G. Schubert, L. Tous, J. Hoornstra
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引用次数: 1

Abstract

The 7th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells took place in October 2017. Through presentations and discussions, it was evident that progress in the field is continuing at a fast pace. The limits of screen printing metallization are being pushed further through innovations in screens and process to finger width below 40 µm while keeping high aspect ratio and industrial applicability, and new screen printing pastes enable the introduction of advanced cell structures. While there does not seem to be much push anymore towards using plated metallization in today’s mainstream cell technology, it is being further improved and used as a key enabler for future cell and module technologies for very high power PV panels. Passivated contacts is an intensively researched topic and progress was reported towards industrial implementation. In the field of cell interconnection, a drop-in replacement to SnPb solder was introduced, while emerging disruptive interconnection technologies were seen to progress well, particularly multiwire interconnection where key improvements in cost and durability have been achieved which are needed for wide adoption.
第七届晶体硅太阳能电池金属化与互连研讨会综述
第七届晶体硅太阳能电池金属化与互连研讨会于2017年10月举行。通过介绍和讨论,很明显,该领域正在继续快速取得进展。通过屏幕和工艺的创新,丝网印刷金属化的限制被进一步推进到40微米以下的指宽,同时保持高长宽比和工业适用性,新的丝网印刷浆料可以引入先进的细胞结构。虽然在今天的主流电池技术中,似乎没有太多的动力去使用镀金属化,但它正在得到进一步的改进,并被用作未来高功率光伏电池板的电池和模块技术的关键推动因素。钝化触点是一个深入研究的课题,并在工业应用方面取得了进展。在电池互连领域,引入了SnPb焊料的插入式替代品,而新兴的破坏性互连技术进展良好,特别是在成本和耐用性方面取得了关键改进的多线互连,这是广泛采用所必需的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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